1、 Product Introduction:

The Nitrogen oven, also known as the dust-free and oxygen free curing oven, is a semiconductor High-temperature oven used for special process requirements such as precision electronic components, photoresist curing, and dust-free drying of electronic ceramic materials. The air inside the oven is enclosed and self circulating, and is repeatedly filtered by a high-temperature resistant and high-efficiency air filter (level 100) to keep the oven studio in a dust-free state. The dust-free oven workshop is made of stainless steel structure. Suitable for precision electronics, solar energy, new materials and other industries such as touch screens, wafers, LEDs, PCB boards, ITO glass, etc. Nitrogen oven (Figure 1)

2、 Main features:

1. Adopting a specially designed high-temperature resistant long shaft motor and powerful multi wing fan blades, the strong suction mechanism ensures uniform temperature distribution, quietness and low noise, and energy conservation;

2. The box is made of fully ceramic fiber insulation, which has the characteristics of fast heating and energy saving;

3. Glass fiber filter for air intake, ensuring cleanliness requirements.

3、 Meet the standards:

1.11158-1989 Technical Conditions for High Temperature Test Chamber

2.2423.2-1989 Test B

4、 Technical parameters:

1. Temperature range: RT~450 ℃;

2. Inner box size: 800 × 600 × 600mm (W × H × D), 700 * 500 * 500 (optional);

3. Number of boxes: 2, arranged vertically, customizable;

4. Inner liner material: SUS321 mirror stainless steel, seamlessly welded to protect the processed parts from any contamination;

5. Heating time (no load): 1.5h;

6. Cooling time (no load): 300 ℃ -50 ℃ Cooling time 1.5-3.5 hours (using water-cooled finned radiator);

7. Heater: Special dust-free heater;

8. Temperature and oxygen content recording: imported paperless recorder;

9. Standard accessories: high-efficiency 99.97% (0.3 u) particulate air filter, differential pressure agent, timer, adjustable partition plate, single-stage temperature controller

Oxygen content:

1. High temperature oxygen content: ≤ 10ppm+oxygen content in the gas source;

2. low temperature oxygen content: ≤ 20ppm+oxygen content in the gas source

3. Temperature control stability: ± 1 ℃; Temperature uniformity: ± 10 ℃ (400 ℃ plateau);

5、 Product configuration:

1. Configure PLC to achieve multi event output control of atmosphere, water and other switches and alarms;

2. Control: The upper and lower furnace chambers can be individually controlled for temperature, ventilation, and alarm protection;

3. Temperature control instrument: Japan Shimadzu FP93 temperature controller;

4. Number of temperature control sections: 4 × 10 sections; Temperature control points: 2 points;

5. Number of over temperature alarm points: 2 points; Number of detection points: 2 points;

6. Alarm protection: Sound and light alarm protection for overheating, disconnection, etc; Overtemperature protection: independent temperature sensing type overtemperature protector; Motor protection: motor overcurrent and water cooling protection; surface

Surface temperature rise:< 30℃